DMN3018SSS document number: ds35501 rev. 5 - 2 1 of 6 www.diodes.com february 2012 ? diodes incorporated DMN3018SSS new product advance information 30v n-channel enhanc ement mode mosfet product summary v (br)dss r ds(on) max i d max t a = 25c 30v 21m ? @ v gs = 10v 7.3a 35m ? @ v gs = 4.5v 5.5a description and applications this mosfet has been designed to minimize the on-state resistance (r ds(on) ) and yet maintain superior switching performance, making it ideal for high efficiency po wer management applications. ? backlighting ? power management functions ? dc-dc converters features and benefits ? low on-resistance ? low input capacitance ? fast switching speed ? esd protected gate ? ?green? component and rohs compliant (notes 1 & 2) ? qualified to aec-q101 standards for high reliability mechanical data ? case: so-8 ? case material: molded plastic, "green" molding compound. ul flammability classification rating 94v-0 ? moisture sensitivity: level 1 per j-std-020 ? terminal connections indicator: see diagram ? terminals: finish ? matte tin annealed over copper leadframe. solderable per mil-std-202, method 208 ? weight: 0.008 grams (approximate) ordering information (note 3) part number case packaging DMN3018SSS-13 so-8 2500/tape & reel notes: 1. eu directive 2002/95/ec (rohs) & 2011/65/eu (rohs 2) compliant. no purposely added lead. halogen and antimony free. 2. diodes inc.?s ?green? policy can be found on our website at http://www.diodes.com. 3. for packaging details, go to our website at http://www.diodes.com. marking information top view logo part no. year: ?11? = 2011 1 4 8 5 n3018ss yy ww xth week: 01 ~ 53 so-8 top view source gate protection diode gate drain body diode equivalent circuit per element s d d g d d s s top view pin configuration esd protected
DMN3018SSS document number: ds35501 rev. 5 - 2 2 of 6 www.diodes.com february 2012 ? diodes incorporated DMN3018SSS new product advance information maximum ratings @t a = 25c unless otherwise specified characteristic symbol value units drain-source voltage v dss 30 v gate-source voltage v gss 25 v continuous drain current (note 5) v gs = 10v steady state t a = 25 c t a = 70 c i d 7.3 5.7 a t<10s t a = 25 c t a = 70 c i d 9.7 7.8 a continuous drain current (note 5) v gs = 4.5v steady state t a = 25 c t a = 70 c i d 5.5 4.3 a t<10s t a = 25 c t a = 70 c i d 7.6 5.8 a pulsed drain current (10 s pulse, duty cycle = 1%) i dm 60 a maximum body diode continuous current i s 2.5 a thermal characteristics @t a = 25c unless otherwise specified characteristic symbol value units total power dissipation (note 4) t a = 25c p d 1.4 w t a = 70c 0.9 thermal resistance, junction to ambient (note 4) steady state r ja 90 c/w t<10s 50 c/w total power dissipation (note 5) t a = 25c p d 1.7 w t a = 70c 1.1 thermal resistance, junction to ambient (note 5) steady state r ja 75 c/w t<10s 42 c/w thermal resistance, junction to case (note 5) r jc 7.6 c/w operating and storage temperature range t j, t stg -55 to +150 c electrical characteristics t a = 25c unless otherwise specified characteristic symbol min typ max unit test condition off characteristics (note 6) drain-source breakdown voltage bv dss 30 - - v v gs = 0v, i d = 250 a zero gate voltage drain current i dss - - 1 a v ds = 24v, v gs = 0v gate-source leakage i gss - - 10 a v gs = 20v, v ds = 0v on characteristics (note 6) gate threshold voltage v gs ( th ) 1 1.7 2.1 v v ds = v gs , i d = 250 a static drain-source on-resistance r ds (on) - 15 21 m v gs = 10v, i d = 10a - 20 35 v gs = 4.5v, i d = 8.5a forward transfer admittance |y fs | - 8.3 - s v ds = 5v, i d = 6.9a diode forward voltage v sd 0.5 - 1.2 v v gs = 0v, i s = 1a dynamic characteristics (note 7) input capacitance c iss - 697 - pf v ds = 15v, v gs = 0v, f = 1.0mhz output capacitance c oss - 97 - pf reverse transfer capacitance c rss - 67 - pf gate resistance r g - 1.47 - v ds = 0v, v gs = 0v, f = 1.0mhz total gate charge (v gs = 4.5v) q g - 6.0 - nc v gs = 10v, v ds = 15v, i d = 9a total gate charge (v gs = 10v) q g - 13.2 - nc gate-source charge q g s - 2.2 - nc gate-drain charge q g d - 1.8 - nc turn-on delay time t d ( on ) - 4.3 - ns v dd = 15v, v gs = 10v, r l = 15 ? ,i d = 1a, r g = 6 ? turn-on rise time t r - 4.4 - ns turn-off delay time t d ( off ) - 20.1 - ns turn-off fall time t f - 4.1 - ns reverse recovery time t r r - 7.3 - ns i f = 9a, di/dt = 500a/ s reverse recovery charge q r r - 7.9 - nc notes: 4. device mounted on fr-4 substrate pc board, 2oz copper, with minimum recommended pad layout. 5. device mounted on fr-4 substrate pc board, 2oz copper, with 1inch square copper plate. 6. short duration pulse test used to minimize self-heating effect. 7. guaranteed by design. not subject to product testing.
DMN3018SSS document number: ds35501 rev. 5 - 2 3 of 6 www.diodes.com february 2012 ? diodes incorporated DMN3018SSS new product advance information 0 5 10 15 20 25 30 0 0.5 1.0 1.5 2.0 2.5 3.0 v , drain-source voltage (v) fig.1 typical output characteristic ds i, d r ain c u r r en t (a) d 0 4 8 12 16 20 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 v , gate-source voltage gs fig.2 typical transfer characteristics i, d r ai n c u r r e n t (a) d v = 5.0v ds t = 150c a t = 125c a t = 85c a t = 25c a t = -55c a 0.01 0.1 04 8121620 i , drain-source current d fig. 3 typical on-resistance vs. drain current and gate voltage r , d r ain-s o u r ce o n- r esistance ( ) ds(on) v = 2.5v gs v = 4.5v gs v = 10v gs 0 0.02 0.04 0.06 0.08 04 8121620 i , drain current d fig. 4 typical on-resistance vs. drain current and temperature r , d r ain-s o u r ce o n- r esistance ( ) ds(on) t = -55c a t = 25c a t = 85c a t = 125c a t = 150c a v = 4.5v gs 0.6 0.8 1.0 1.2 1.4 1.6 50 -25 0 25 50 75 100 125 150 t , junction temperature ( c) fig. 5 on-resistance variation with temperature j r , d r ain-s o u r c e on-resistance (normalized) ds(on) v = 4.5v i= 5a gs d v=v i= 10a gs d 10 0 0.02 0.04 0.06 0.08 - 50 -25 0 25 50 75 100 125 150 t , junction temperature ( c) fig. 6 on-resistance variation with temperature j r , d r ai n -s o u r c e o n - r esis t a n c e ( ) ds(on) v = 4.5v i= 5a gs d v=v i = 10a gs d 10
DMN3018SSS document number: ds35501 rev. 5 - 2 4 of 6 www.diodes.com february 2012 ? diodes incorporated DMN3018SSS new product advance information 0 0.4 0.8 1.2 1.6 2.0 2.4 -50 -25 0 25 50 75 100 125 150 t , junction temperature ( c) fig. 7 gate threshold variation vs. ambient temperature j i= 1ma d i = 250a d v , gate threshold voltage (v) gs(th) 0 5 10 15 20 0 0.2 0.4 0.6 0.8 1.0 1.2 v , source-drain voltage (v) sd fig.8 diode forward voltage vs. current i, s o u r c e c u r r e n t (v) s t= 25c a 0 5 10 15 20 25 30 v , drain-source voltage (v) ds fig. 9 typical drain-source leakage current vs. voltage 1 10 100 1,000 10,000 i, d r ai n leaka g e c u r r e n t (na) dss t = 25c a t = 85c a t = 125c a t = 150c a 0 5 10 15 20 v , drain-source voltage (v) ds fig. 10 typical junction capacitance 10 100 1,000 c , j u n c t i o n c a p a c i t a n c e (p f ) t c iss f = 1mhz c oss c rss 02 4 6 810121416 q (nc) g fig. 11 gate charge , total gate charge 0 2 4 6 8 10 v g a t e t h r es h o ld v o l t a g e (v) gs v = 15v, i = a ds d 9
DMN3018SSS document number: ds35501 rev. 5 - 2 5 of 6 www.diodes.com february 2012 ? diodes incorporated DMN3018SSS new product advance information 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000 t1, pulse duration time (sec) fig. 12 transient thermal resistance r = r * r ja(t) (t) ja ja r = 72c/w duty cycle, d = t1/t2 0.001 0.01 0.1 1 r(t), t r ansien t t h e r mal r esis t an c e d = 0.5 d = 0.7 d = 0.9 d = 0.3 d = 0.1 d = 0.05 d = 0.02 d = 0.01 d = 0.005 d = single pulse package outline dimensions suggested pad layout so-8 dim min max a - 1.75 a1 0.10 0.20 a2 1.30 1.50 a3 0.15 0.25 b 0.3 0.5 d 4.85 4.95 e 5.90 6.10 e1 3.85 3.95 e 1.27 typ h - 0.35 l 0.62 0.82 0 8 all dimensions in mm dimensions value (in mm) x 0.60 y 1.55 c1 5.4 c2 1.27 gauge plane seating plane detail ?a? detail ?a? e e1 h l d e b a2 a1 a 45 7 ~ 9 a3 0.254 x c1 c2 y
DMN3018SSS document number: ds35501 rev. 5 - 2 6 of 6 www.diodes.com february 2012 ? diodes incorporated DMN3018SSS new product advance information important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries rese rve the right to make modifications, enhancements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. diodes incorporated does not assume any liability arising out of the application or use of this document or any product described he rein; neither does diodes incorporated convey any license under its patent or trademark rights, nor the rights of others. any customer or user of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold diodes incorporated a nd all the companies whose products are represented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthoriz ed sales channel. should customers purchase or use diodes inco rporated products for any unintended or una uthorized application, customers shall i ndemnify and hold diodes incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death a ssociated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or more united states, international or foreign trademarks. life support diodes incorporated products are specifically not authorized for use as critical com ponents in life support devices or systems without the express written approval of the chief executive offi cer of diodes incorporated. as used herein: a. life support devices or syst ems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support devic e or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-rel ated requirements concerning the ir products and any use of diodes incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporate d and its representatives against any damages arisi ng out of the use of diodes incorporated pr oducts in such safety-critical, life suppor t devices or systems. copyright ? 2012, diodes incorporated www.diodes.com
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